A groundbreaking technical paper titled “PPAC Driven Multi-die and Multi-technology Floorplanning” has been jointly published by Texas A&M University and Duke University. The paper, authored by Roman-Vicharra, Chen, and Hu, explores the complexities of floorplanning in heterogeneous integration, where different dies utilize distinct technologies. The study emphasizes the importance of simultaneous technology selection in multi-die floorplanning, taking into account not just area and wirelength but also performance, power, and cost.
The researchers developed a simulated annealing method and reinforcement learning techniques to address the challenges of multi-die and multi-technology floorplanning. Experimental results demonstrated that these techniques outperformed a naive baseline approach, showcasing the potential for more efficient and effective floorplanning strategies in the future.
The technical paper, available on arXiv, provides valuable insights into the complexities of floorplanning in multi-die heterogeneous integration scenarios. By incorporating performance, power, and cost considerations into the floorplanning process, the researchers have laid the foundation for more advanced and optimized floorplanning techniques.
This research has the potential to impact various industries that rely on heterogeneous integration, such as semiconductor manufacturing and electronic design automation. The findings offer new possibilities for improving the efficiency and performance of integrated systems across different technologies and dies.
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